Paris, France, August 6, 2008 - Dassault Systèmes (DS) (NASDAQ: DASTY, Euronext Paris: #13065. DSY. PA), a world leader in 3D and Product Lifecycle Management (PLM) solutions, today announced that its 3DVIA brand for lifelike 3D product experiences will be showcasing the latest in highly-interactive 3D and virtual reality technology at the SIGGRAPH 2008 Conference, taking place in Los Angeles from August 11 to August 15. Joined by many of its technology partners in its booth, #1217, 3DVIA will provide attendees with an exciting look at the 3D advancements enabled by its 3DVIA Virtools application development platform.
In addition to this contest, virtual reality applications will be demonstrated in the booth and will allow visitors to immerse themselves in an interactive application thanks to a VR headset. The Philips 42” WOW 3D Intelligent Display, a 42” autostereoscopic 3D display supported through the 3DVIA Virtools VR Library, will serve as the second screen on which those virtual reality applications will be displayed. This will allow conference goers to see the exciting out-of-screen true autostereoscopic effects of the screen.
Visitors to the 3DVIA booth can see presentations from more 3DVIA technology partners including:
• INRIA: Stéphane Donikian will be discussing the integration of INRIA's Bunraku team softwares MKM (a real-time animation engine for synthetic humans) and Topoplan (a topological 3D path finder) with 3DVIA Virtools.
• Isart Digital: Gautier De Souza will be introducing 3DVIA Virtools and providing examples of prototypes.